Products

PRODUCTS

HBM

Chip

Embedded
Macro IP

DX-MRAM DDR4/5 HBM/CHIP FAMILY
The DDR4/5 DX-MRAM HBM/Chip Family is a set of MRAMs (magneto-resistive random-access memories) with DX-bitcell architecture. It is fully compatible with the DDR4/5 DRAM HBM/chip and capable of completely replacing it.

DX-MRAM has all the advantages of both MRAM and high memory density: fast speed, high bandwidth, low power consumption, low cost, a standard logic process, and highly efficient in/near memory computing through easy integration with CPUs/GPUs/ALUs/glue-logic. Moreover, DX-MRAM allows for instant booting and, since it is an NVM (non-volatile memory), does not lose data when it loses power. Thus, DX-MRAM is the best working memory solution for AI, smartphones, and automobiles.

eDX-MRAM MACRO FAMILY IP
The eDX-MRAM macro family is a set of DRAM-like embedded MRAMs (magneto-resistive random-access memories) with DX-bitcell architecture. These eDX-MRAM macros can be embedded in AI Chips/SoCs and have all the capabilities of SRAM, eFlash, and eDRAM on a single chip. The eDX-MRAM macro is mostly compatible with the DRAM core.

HBM/Chip Family Features

Very large capacity per die :

1Gb/
32Gb/64Gb/128Gb/
256Gb(DDR4/5 in dev./plan)

Very large capacity HBM :

Up to 256GB( in dev./plan)

JEDEC compliant in order to displace DDR4/5 DRAM chip (X4/X8/X16 DDR4/5

FBGA78/96)

Instantly bootable applications
No data loss when power off or out
No refresh operation, decreased power consumption
Flash/DRAM/SRAM all in one
DX-bitcell technology

Macro Family Features

Very large capacity per macro: 4Mb – 16Gb in dev./plan
Mostly compatible with DRAM core
On chip high band width AI memory macro for in/near memory computing
Instantly bootable applications
No data loss when power off or out
No refresh operation, decreased power consumption
SRAM/eFlash/eDRAM all in one
DX-bitcell technology