DX-HBM: High-Capacity Potential

 up to 8x 
​Capacity Increase
Compared to conventional HBM

 < 10nm
     Process Node
       Enabling smaller, more efficient chips

eDX-MRAM: Embedded Memory for AI Chips

​Embedded Solution
eDX-MRAM provides on-chip memory integration for AI processors. It eliminates the need for separate memory chips.

​This tight integration reduces latency and power consumption while increasing performance.

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DX-AI Architecture
​When integrated with AI compute cores, the architecture is called DX-AI. This allows for revolutionary compute efficiencies.

​Unlike DRAM, DX-MRAM can be directly integrated with processing elements.


​

DX-AI: Revolutionizing AI Chip Architecture

​Overcoming HBM Limitations
Vertical Die Structure
HBM relies on stacked dies with through-silicon vias. This limits potential I/O scaling between memory and processor.
I/O Constraints
Current HBM designs max out at 1024-2048 I/O connections. This creates a performance ceiling that's difficult to overcome.
​eDX-MRAM Solution
By enabling direct integration with compute logic, eDX-MRAM enables up to a thousand times more parallel connections than HBM, using metal lines instead of TSVs. This significantly boosts memory bandwidth, as it is directly proportional to the number of I/Os.